RoboFEI 2014 Team Description Paper
Fernando Rodrigues Jr., Danilo Pucci, Feliphe G. Galiza, Caio Schunk, Vitor
Hugo M. Beck, Francisco Biaso, Victor Torres, Thiago Silva, Victor Amaral,
Jos´
e Angelo Gurzoni Jr., Reinaldo A. C. Bianchi, and Flavio Tonidandel
Robotics and Artificial Intelligence Laboratory
Centro Universit´
ario da FEI, S˜
ao Bernardo do Campo, Brazil
{
flaviot, rbianchi
}
@fei.edu.br
Abstract.
This paper presents an overview of the RoboFEI team state
for the RoboCup Small Size League competition.
The paper contains descriptions of the mechanical, electrical and soft-
ware modules, designed to enable the robots to achieve playing soccer
capabilities in the dynamic environment of the Small Size League.
1
Introduction
For the RoboCup 2014, RoboFEI team intends to use basically the same elec-
tronic project that has been used during the last four years, with minor mod-
ifications. The Mechanical design is under maintenance, studies are focused to
avoid the chip kick parts deformations.
The strategy software has been refactored and turned the code more ag-
ile, easy and efficient. The next step is add new features and functionalities to
improve the robot’s skills.
2
Electronic Design
The electronic design has been used for the last four years and received few
modifications since reached desired performance and stage of development.
RoboFEI’s electronic consists of two boards: the main board is responsible
for all embedded computation and robot’s motion control. The Kicker board
commands the kicking devices and it’s associated power electronics. These two
boards are described in details in this section.
2.1
Main Board
The main board (Fig. 1) has a Xilinx Spartan 3 FPGA (XC3S400) responsible
for performing all the logic and control functions. Embedded into this FPGA are
a soft-core microcontroller IP, the Microblaze running on version 8.1, five brush-
less motor controllers, sensor control modules and the kicker board command.
The integration of all the functions, including the microcontroller, in the same
IC eliminates the difficulties related to component interconnection and avoids